Hack3D_2019

The CSAW 3D Printing Security Challenge






What is Hack3D?

Hack3D is one of CSAW's latest cybersecurity competition with an aim to raise awareness and generate discussion in engineering and research communities about security in the additive manufacturing (AM) field.

Competitors will have the opportunity to learn and use skills in graphics programming, file manipulation, and reverse engineering while gaining an understanding of the additive manufacturing supply-chain.

Take a look at the rules and guidelines

Students who are interested to learn more about CAD, reverse-engineering, security, and additive manufacturing are encouraged to apply.

Have you registered yet?

The Qualifying Round

The Wise Duckling says:"To heal yourself, you might seek within yourself". We're not sure what he's on about.

Problem Statement:

A hacktivist group on campus is looking around for new talent for an upcoming cyber-attack on Big3D, a 3D printer manufacturing company, and you are eager to join.

The repaired .gcode could be any of the three chess pieces (pictured in the package). You should repair it to reconstruct only one of the pieces. While there are no wrong answers, there is a correct answer.

Be sure to document all your attempts and thought processes in a report and submit it along with the attempted .gcode repair to csaw-3D@nyu.edu

Download the .gcode

Contact Us:

If you have any questions, please contact us at csaw-3d@nyu.edu